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Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine

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Shenzhen Hongxinteng Technology Co., Ltd.

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Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine

Brand Name : GKG

Model Number : GD602D

Certification : CE

Place of Origin : China

MOQ : 1

Price : 26000

Payment Terms : T/T

Supply Ability : The production capacity is 30 units a month

Delivery Time : 20-25

Packaging Details : Vacuum packing plus wooden box packing

Application : COB flexible Strip light

Name : Flip Chip Die Bonder

Maximum board size : 152MMX152MM

Condition : Original new

Usage : SMD LED SMT

core components : PLC, Engine, Bearing, Gearbox, motor, Pressure vessel, Gear, Pump

Brand : GKG

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Fully Automatic Smt Production Line Flip Chip Die Bonder Machine For COB Strip Light and Semiconductor Packaging Chip Mounting Electronics Machinery

High-Speed Flexible Strip Die Bonder

Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine

Product Features
1. Utilizes a sheet-to-sheet docking station with dual swing arms for 180° cross-bonding.

2. Compatible with a printer to enable a variety of in-line process solutions.

3. Fully integrated carrier from loading, printing, to die bonding and placement.

4. The carrier supports 0.5M materials, and mid-process transfers are accomplished using a docking station.

5. Equipped with a variety of practical features, including automatic calibration, automatic die ring changer, and a feeder-style quick-release workbench.

Product specification

Speed of die attach	≥60ms UPH: 60K/h (actual production capacity depends on wafer and substrate size and process requirements)
Position accuracy of die attach	± 1 mil (± 25um)
Angle accuracy of wafer	± 1 °
Crystal loss detection function	With (vacuum detection mode)
Solid leakage detection function	With (vacuum detection mode)
Capacity statistics function	Yes
Statistical function of consumables usage	Yes
Function of parameter modification record	Yes
User privilege management function	Yes
Module of wafer worktable
Size of the chip	3milx5mil-60mlx60mil
Thickness of the wafer	0.1-0.7 mm
Maximum correction angle of wafer	± 15 °
Maximum size of wafer and wafer ring	6“Crystal Ring (152 mm outer diameter) .”
Maximum area size of wafer	4.7“(119 mm)
Maximum travel of worktable	152MMX152MM
XY resolution	0.5 um
Thimble height travel in z direction	3 mm
Thimble cap	Single Needle (with)
Motor and drive system	Home-made linear motor & Huichuan District Drive
Image recognition system
Methods of image recognition	256 grayscale
Image resolution	720 * 540
Accuracy of image recognition	± 0.025 Mil@50 Mil observed range
Foolproof function of chip	Yes
Pre-consolidation testing function	Yes
Post-consolidation image detection function	Yes
Mode of feeding	Automatic connection of incoming and outgoing materials
Solid Crystal Swing Arm System
The way of fixing crystal	Double Swing Arm 180 ° rotation solidification
Suction pressure of crystal	30g-250g adjustable
Manual adjustment of suction nozzle vacuum sensitivity	Yes
Module of substrate workbench
Mounting speed	5000-6000UPH
Range of travel of worktable	140mmx620mm
Adapt to the width of the substrate	60-120mm
Adapt to the length of the substrate	100-600mm
Thickness of substrate	0.1-2mm
XY resolution	0.5um
Motor and drive system	Home-made Linear Motor & Huichuan District Drive
Fixing method of base plate	Manipulator plus vacuum suction platform

Applications:

Product application
COB flexible lamps are mainly used in smart home, intelligent lighting, car decoration, intelligent decoration and other applications.

Applicable products: Flexible Lamp Belt (FPC, PCB, BT) , SMD, resistors, IC components and other flip-chip products solid crystal.

Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine